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STD3NB50 ES51991 HT80C51 3ST3T SBM39PT 0XN1TR SZN4987 52045
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  Datasheet File OCR Text:
 SOT223 N-CHANNEL ENHANCEMENT MODE LOW THRESHOLD VERTICAL DMOS FET
ISSUE 2 - FEBRUARY 1996 FEATURES * LOW RDS(ON) - 3 7
ZVNL110G
D
PARTMARKING DETAIL - ZVNL110 D G
S
ABSOLUTE MAXIMUM RATINGS.
PARAMETER Drain-Source Voltage Continuous Drain Current at T amb=25C Pulsed Drain Current Gate-Source Voltage Power Dissipation at T amb=25C Operating and Storage Temperature Range SYMBOL V DS ID I DM V GS P tot T j:T stg VALUE 100 600 6 20 2 -55 to +150 UNIT V mA A V W C
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated).
PARAMETER Drain-Source Breakdown Voltage SYMBOL MIN. BV DSS 100 0.75 1.5 100 10 100 750 4.5 3.0 225 75 25 8 7 12 15 13 MAX. UNIT CONDITIONS. V V nA A A mA mS pF pF pF ns ns ns ns V DD25V, I D=1A, V GS =10V V DS=25V, V GS=0V, f=1MHz I D=1mA, V GS=0V I D =1mA, V DS= V GS V GS= 20V, V DS=0V V DS=100V, V GS=0V V DS=80V, V GS=0V, T=125C(2) V DS=25V, V GS=5V V GS=5V, I D=250mA V GS=10V, I D=500mA V DS=25V, I D=500mA
Gate-Source Threshold Voltage V GS(th) Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Current(1) Static Drain-Source On-State Resistance (1) I GSS I DSS I D(on) R DS(on)
Forward Transconductance(1)(2) g fs Input Capacitance (2) Common Source Output Capacitance (2) C iss C oss
Reverse Transfer Capacitance (2) Crss Turn-On Delay Time (2)(3) Rise Time (2)(3) Turn-Off Delay Time (2)(3) Fall Time (2)(3) t d(on) tr t d(off) tf
(1) Measured under pulsed conditions. Width=300s. Duty cycle 2% (2) Sample test. (3) Switching times measured with 50 source impedance and <5ns rise time on a pulse generator
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